Component mounting apparatus and component mounting method

Details Component mounting apparatus and component mounting method Component mounting apparatus and component mounting method

2006-04-04

2006-04-04

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C029S740000

Reexamination Certificate

active

07021357

ABSTRACT:
A component-mounting apparatus is provided with a pallet-carrying unit that carries a pallet, holding boards, within the apparatus. The pallet-carrying unit carries the pallet to a loading unit for feeding boards to the pallet, an ACF applying unit for applying an ACF tape onto the boards, a pre-press bonding unit for positioning components relative to the boards and bonding the components with a first pressing force, a final bonding unit for bonding the components to the boards with a second pressing force larger than the first pressing force so as to fix the components onto the boards, and an unloading unit for removing the boards, with the components mounted thereon, from the pallet. Then, the pallet-carrying unit returns the pallet from the unloading unit to the loading unit.

REFERENCES:
patent: 3646656 (1972-03-01), Zilahy et al.
patent: 5414617 (1995-05-01), Pomerleau et al.
patent: 5932065 (1999-08-01), Mitchell
patent: 6446948 (2002-09-01), Allen
patent: 6612546 (2003-09-01), Young et al.
patent: 6618937 (2003-09-01), Onitsuka
patent: 03158310 (1991-07-01), None
patent: 2001210999 (2001-08-01), None
English abstract for JP 03158310.
Machine translation for JP 2001210999.
english abstract for JP 2001210999.

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