Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
1998-01-21
2004-09-14
Tugbang, A. Dexter (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S720000, C029S739000, C029S741000, C029S743000, C029S833000, C029S834000
Reexamination Certificate
active
06789310
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to component mounting apparatus and method for automatically mounting a variety of components such as electronic components onto a printed circuit board or the like, and a component mounting equipment including the apparatuses.
Generally, in an electronic component mounting apparatus, a number of component supply means are mounted in parallel to one another on a component supply table. In a component mounting stage, the component supply means are successively positioned in a specified component supply position according to a sequence of mounting components while moving the component supply table in a direction in which the component supply means are arranged in parallel. Then, each of the components at the component supply means is taken out by suction by a mounting head section, and the components are transferred to a circuit board positioned in the circuit board positioning section to be subjected to a component mounting process.
This type of conventional component mounting apparatus will be described with reference to
FIG. 6
showing a perspective view of it and
FIG. 7
showing a schematic plan view of it. In
FIG. 6
, at the front of an apparatus body
1
is provided a board positioning section
4
for positioning a circuit board P supplied from a board supply means
2
in a mounting position, and the circuit board P mounted with the required components in the board positioning section
4
is discharged by a board discharge means
3
. On the other hand, at the rear of the apparatus body
1
is provided a component supply section
7
, and a rotary type mounting head section
8
is provided between the component supply section
7
and the aforementioned board positioning section
4
as shown in FIG.
7
.
In the component supply section
7
, two component supply tables
10
and
11
are laterally movably provided independently of each other on a guide rail
9
. The component supply tables
10
and
11
are mounted with a number of component supply means
12
arranged in parallel to one another in a direction in which the component supply tables
10
and
11
move. There is illustrated generally a so-called parts cassette as the component supply means
12
, and it will be simply described below. That is, electronic components of an identical type are stored and arranged at regular intervals on a carrier tape while being wound around a reel
13
as covered with a cover tape. By drawing out the carrier tape from the reel
13
to feed it at a pitch equal to the storage intervals of the components and taking up the cover tape, the electronic component located at the leading end is positioned in a component supply position A opposite to a component suction head
14
of the mounting head section
8
.
Furthermore, as shown in
FIG. 7
, the mounting head section
8
is constructed by providing a plurality of component suction heads
14
at regular angular intervals on an identical circle of a rotary table (not shown) provided rotatably around a vertical axis. Each component suction head
14
is designed to suck a component by vacuum suction means. Upon intermittently rotating the rotary table, it is stopped in steps in the component supply position A and a component mounting position B in order to concurrently perform receiving of each component from the component supply means
12
and mounting of each component onto the circuit board P. While one component supply table
10
is supplying components, the other component supply table
11
that is retreating in a standby position performs changing of component supply means
12
and replenishing of components thereby achieving preparation so that the component mounting apparatus can be operated continously.
In recent years, there has been a growing trend in that the types of circuit boards P to be manufactured and the types of components to be mounted on the circuit boards P are increasing. In order to cope with the above, be one solution to be considered is to increase the number of component supply means
12
on be mounted to the component supply tables
10
and
11
. However, in such a case, the component supply tables
10
and
11
are to be elongated sidewise in order to increase the number of component supply means
12
. Consequently, the length of the entire component supply section
7
becomes very long, and this leads to a degraded space utilization efficiency, reducing the productivity per floor area.
A more important issue is that the component supply tables
10
and
11
are fed at a pitch in accordance with taking out the components by the mounting head section
8
, and therefore, the following inconvenience occurs. That is, when the component supply tables
10
and
11
increase in weight due to the increase of their lengths, not only is a greater drive power required to move the component supply tables
10
and
11
but also the inertial force of the component supply tables
10
and
11
increases. Therefore, vibration in feeding the component supply tables
10
and
11
at a pitch significantly increases. Consequently, it is impossible to increase the component supply rate, or the component mounting operation speed.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a component mounting apparatus and method capable of increasing the component mounting operation speed without dimensionally increasing the whole apparatus even when the types of boards and the number of components to be mounted on each board increase.
In accomplishing these and other objects, according to a first aspect of the present invention, there is provided a component mounting apparatus comprising:
a pair of component supply tables on which components are accommodated and which are arranged on both sides of a board mounting position where a board is positioned;
a first mounting head section for successively picking up the components at one of the component supply tables and thereafter successively mounting the picked-up components onto the board; and
a second mounting head section for successively picking up the components at the other of the component supply tables and thereafter successively mounting the picked-up components onto the board,
wherein the first and second mounting head sections are independently operated.
According to a second aspect of the present invention, there is provided the component mounting apparatus as described in the first aspect, wherein the first and second mounting head sections are controlled mutually in operation in accordance with a timing at which, when one of them carries out a component picking-up operation for picking up the components from the component supply table, the other of them carries out a component mounting operation for mounting the picked-up components onto the board.
According to a third aspect of the present invention, there is provided the component mounting apparatus as described in the first aspect, wherein one of the first and second mounting head section has component suction nozzles sucking the components at one time.
According to a fourth aspect of the present invention, there is provided the component mounting apparatus as described in the second aspect, wherein one of the first and second mounting head section has component suction nozzles sucking the components at one time.
According to a fifth aspect of the present invention, there is provided a component mounting equipment comprising:
a plurality of component mounting apparatuses each of which was described in the description of the first aspect,
wherein a board transfer path along which the board is supplied to the board mounting position of the apparatus and discharged from the board mounting position of the apparatus by a board transfer device is provided so that the board transfer path connects the board mounting positions of the component mounting apparatuses, and the component supply tables of the component mounting apparatuses are arranged on both sides of the board mounting positions in the board transfer path.
According to a sixth a
Hata Kanji
Yoshida Noriaki
Kim Paul
Matsushita Electric - Industrial Co., Ltd.
Tugbang A. Dexter
Wenderoth , Lind & Ponack, L.L.P.
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