Component mounted to substrate with overlying bridge-shaped supp

Details Component mounted to substrate with overlying bridge-shaped supp Component mounted to substrate with overlying bridge-shaped supp

1989-01-30

1990-01-30

Sikes, William L.

Radiant energy

Ionic separation or analysis

Static field-type ion path-bending selecting means

350 9611, 350 9612, 350 9615, 350 9617, 250227, 357 17, 357 19, 357 74, 357 80, 372107, G02B 636, H01L 2302, H01S 308

Patent

active

048969362

ABSTRACT:
An optical component such as a laser chip is mounted on a substrate. The chip is mounted on a bridge positioned on the substrate locator in the form of depending legs provided on the bridge so that the bridge is located in the vertical direction relatively to the substrate and hence the laser chip is also located. Finally, the chip is secured to the substrate by, for example, soldering.

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patent: 4820013 (1989-04-01), Fuse
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Patents Abstracts of Japan, vol. 9, No. 27(E-294)(1750) 6 Feb. 1985, & JP, A.59-172787 (Sharp K.K.), 29 Sep. 1984.
IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979, IBM Corp., N.Y., U.S., L. D. Comerford: "Etched Silicon Structure for Aligning a Photodiode and Optical Fiber", pp. 2935-2936.

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