Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
1999-04-26
2001-05-08
Sanghavi, Hemang (Department: 2874)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S089000, C385S092000, C385S052000, C385S014000
Reexamination Certificate
active
06227722
ABSTRACT:
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to a component module.
Such a component module is used in the field of multichannel optical (data) communications, in which electrooptical component modules (so-called electrooptical modules) with a plurality of closely spaced optical channels are employed. The goal is to achieve the largest possible scale of integration, that is a small module size. Typically, the modules are intended for optical coupling, for instance to a data line with an optical pc bay or plug rack, in which a plurality of optical waveguide ends and thus a plurality of separate optical channels are carried in a plug connector part. Stringent demands are made in the production and assembly of such component modules.
A component module is known from European Patent Application EP 0 699 931 A1 to include a first substrate with optical waveguides having end surfaces that are beveled. Radiation emitted by the optically active zones of a converter mounted on a second substrate is coupled into the optical waveguides by total reflection from the end surfaces. Corresponding metallizations are provided on the substrates and on the converter in order to align the converter and the substrate with one another. During assembly, the surface tension of solder melted onto the metallizations is exploited for the sake of adjustment.
A coupling configuration is known from U.S. Pat. No. 5,420,954 in which surface-emitting laser diodes are disposed on the rear side of a first substrate. A plurality of optical waveguides end on an end surface of a second substrate and are aligned with the laser diodes through the use of parallel alignment pins and corresponding recesses on the first substrate.
In a further component module known from European Patent Application EP 0 682 279 A1, an optoelectronic element (for instance in the form of a photodiode) is disposed in such a way as to face toward the first surface of a semiconductor substrate. A V-shaped indentation and a V-shaped groove perpendicular thereto are provided on a second surface that is coplanar with the first surface for receiving an end of an optical waveguide. Light exiting the optical waveguide penetrates into intervening substrate material and is deflected by the side of the substrate material toward the indentation, on through the substrate and onto the photodiode. That coupling configuration is also comparatively complicated and involves optical losses.
German Published, Non-Prosecuted Patent Application DE 197 09 842 A1 discloses a coupling component module which includes a first plastic molded body as a substrate for a plurality of optical waveguides. Beveled end surfaces of the optical waveguides cause a beam deflection onto the optically active zones of a multichannel elecrooptical converter, which is fixed on a second substrate. The two substrates have cooperating alignment measures, in the form of oblique longitudinal surfaces that extend parallel to the optical waveguides and intersect the plane of the optical waveguides. The surfaces create a form lock, and as a result the end surfaces of the ends of the optical waveguides are laterally adjusted relative to the optically active zones. A form-locking connection is one which connects two elements together due to the shape of the elements themselves, as opposed to a force-locking connection, which locks the elements together by force external to the elements.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide a compact, large-scale integrated component module, which overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type and which can be produced simply and without active adjustment provisions by known, well-mastered manufacturing techniques.
With the foregoing and other objects in view there is provided, in accordance with the invention, a component module, comprising a substrate having a top side and having elecrooptical converters with active zones; a plurality of optical waveguides disposed on the top side of the substrate, the optical waveguides having first ends each optically coupled to a respective associated one of the active zones of the elecrooptical converters; first positioning structures generated by planar structuring and disposed on the top side of the substrate; and a plug connector part connected to the substrate, the plug connector part having at least one mechanical alignment element for mechanical alignment relative to a complementary plug connection partner, and the plug connector part having a joining side facing toward the top side of the substrate, the joining side having second positioning structures cooperating with the first positioning structures.
Within the scope of the invention, an optical waveguide is understood to mean a device for transmitting an optical signal so that it is guided in a spatially defined way, especially so-called striplines or waveguides,, which may possibly require a jacket or outer coating (“cladding”) with a lower index of refraction, for that purpose. An elecrooptical converter is understood to mean both a transmitting and a receiving element (such as light emitting diodes, surface-emitting laser diodes, or photodiodes). The optically active zone of the converter in a transmitter is understood as a light emitting surface, while in a receiver it is understood as a light-sensitive surface.
One substantial advantage of the present invention is considered to be that the coupling device belonging to the component module is made essentially in two parts. In other words, it includes at least part of the substrate, which is joined to the plug connector part through the joining side. This advantageously makes it possible to combine the advantages of different production techniques oriented to a specific material and a specific application in a single component (coupling component module) and thus to utilize them synergistically. The substrate and the optical waveguides can be configured in a desired way by planar structuring, and the requisite steps to achieve this are mastered in semiconductor technology and integrated optics with high precision and comparatively low costs. Recourse can be had to many suitable substrate materials with a view to the available production process therefor. Regardless of this, the plug connector part may be formed of a different material, which is optimized in terms of the plug connection properties, and can be made, for instance, by suitable, high-precision plastic molding techniques known from the field of precision injection molding, for instance for optical waveguide plugs. Suitable injection molding methods are described, for instance, in an article entitled “Design and Performance Advance in MT Connectors”, by D. Braga and C. Whitelaw, in LIGHTWAVE, November 1997, pp. 61 ff.
Another substantial advantage of the component module of the invention is that because of the positioning structures provided with maximum precision on the corresponding parts (the substrate and the plug connector part), adjustment-free assembly of these parts is possible. The positioning structures can be made so precisely by the molding processes that after assembly, the alignment element is positioned exactly relative to the optical waveguides.
In accordance with another feature of the invention, the first positioning structures are formed from optical waveguide material. This feature is an advantageous refinement with regard to the precision of the positioning structures of the substrate.
As already explained above, present well-mastered surface structuring processes allow the use of many different substrate materials. For example, conventional printed circuit board material can be used. However, in accordance with a further feature of the invention, the plug connector part is a plastic molded part, and the substrate is formed of quartz glass.
In accordance with a concomitant feature of the invention, both indentations for receiving the optical waveguides and indentations that function as first pos
Greenberg Laurence A.
Lerner Herbert L.
Sanghavi Hemang
Siemens Aktiengesellschaft
Stemer Werner H.
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