Metal fusion bonding – Process – Plural joints
Patent
1980-06-26
1983-02-15
McGlynn, Joseph H.
Metal fusion bonding
Process
Plural joints
29832, 29837, 174 685, 228 39, 228215, H05K 334, B23K 3102
Patent
active
043736556
ABSTRACT:
Component masks are described for preserving unoccupied holes in a printed circuit board when such board is subjected to wave soldering. Each mask is a body of plastic resistant to adherence to the solder and capable of withstanding the temperature of solder when the printed circuit board is subjected to wave soldering and includes a supporting block from which a plurality of parallel pins protrude for reception into the printed circuit board lead-holes to be preserved. The pins are spaced from one another by distances equal to the distances between lead-holes on a printed circuit board, and component masks are provided respectively having a single row and a double row of such pins. Each pin is tapered slightly toward its free end, and is connected to its associated supporting block by a conically shaped transition body. Each transition body is dimensioned to rest on the printed circuit board about the lead-hole in which the associated pin is inserted to space the supporting block away from the printed circuit board. The pins are dimensioned and configured to enable the lead-holes to be preserved during mass soldering of the printed circuit board, while at the same time allowing their interior walls to be wetted with solder.
REFERENCES:
patent: 3059152 (1962-10-01), Khouri
patent: 3246386 (1966-04-01), Ende
patent: 3524960 (1970-08-01), Lohff
patent: 3525143 (1970-08-01), De Vito
patent: 3604836 (1971-09-01), Pierpont
patent: 4246627 (1981-01-01), Poensgen
Skip-A-Dip, Micro Electronic Systems, Inc.
Mass Soldering Loading Fixture Having Masking Pins, Western Electric, _Technical Digest No. 21, Boyer et al, Jan. 1971.
McGlynn Joseph H.
Mossino Ralph L.
Silverberg Fred A.
Zimmerman C. Michael
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