Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1988-03-01
1991-01-15
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29740, 118504, 156556, 228 62, B32B 100
Patent
active
049851071
ABSTRACT:
Electrical circuit components such as integrated circuit chips with plural closely-spaced mounting feet/terminals are mounted on surface-mount connection pads on a printed circuit board very simply and easily by mechanical means. An alignment pattern member having very precisely located holes matching the array of pads on the printed circuit board is used. The feet of the component first are fitted into the holes in the pattern to orient and locate them accurately, then the pattern and the component are separated from one another, and the component is placed with the feet on the pads. Preferably, the component is picked up with a vacuum pick-up device to remove it from the pattern, an is lowered onto the pads of the circuit board by the same mechanism. In an alternate embodiment, the printed circuit board and the pattern are secured to a sliding table which removes the pattern from beneath the vacuum pick-up device and moves a printed circuit board into position underneath the vacuum pick-up devices, which then lower the components onto the pads. Advantageously, the pattern member is made with a stencil used to apply solder paste to the pads.
REFERENCES:
patent: 3355078 (1967-11-01), Smith
patent: 3516155 (1970-06-01), Smith
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3970934 (1976-07-01), Aksu
patent: 4099120 (1978-07-01), Aksu
patent: 4159176 (1979-06-01), De Masi
patent: 4292116 (1981-09-01), Takahashi et al.
patent: 4357575 (1982-11-01), Uren
patent: 4410928 (1983-10-01), Aramaki
patent: 4479298 (1984-10-01), Hug
patent: 4512509 (1985-04-01), Ellis et al.
patent: 4548667 (1985-10-01), Wical
patent: 4595794 (1986-06-01), Wasserman
patent: 4722135 (1988-02-01), Read
Conroy Walter J.
Katona William
SCI Systems Inc.
Simmons David A.
LandOfFree
Component location device and method for surface-mount printed c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Component location device and method for surface-mount printed c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component location device and method for surface-mount printed c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-53360