Component lead processing apparatus

Details Component lead processing apparatus Component lead processing apparatus

1983-12-05

1985-12-10

Goldberg, Howard N.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29838, B23P 2100

Patent

active

045570434

ABSTRACT:
A plurality of electrically conductive heads for bending the leads of components mounted on a printed circuit board are coupled to an apparatus for testing the component prior to bending and soldering the leads. The heads electrically contact the leads of the component prior to and during bending. A testing apparatus indicates that the component is present and can also test one or more electrical parameters of the component. The test apparatus indicates whether the component is good or bad prior to the bending of the component leads to facilitate replacing the component before it is soldered in place.

REFERENCES:
patent: 2827634 (1958-03-01), Kwasniewski
patent: 2907040 (1959-10-01), Woods
patent: 3414024 (1968-12-01), Anderson et al.
patent: 4153082 (1979-05-01), Foley
patent: 4165557 (1979-08-01), Taguchi et al.
patent: 4218817 (1980-08-01), Takano
patent: 4464829 (1984-08-01), Whitley et al.
"Pin Sensor for Parts Identification," by R. T. Adsmond et al., IBM Technical Disclosure Bulletin, vol. 13, No. 9, Feb. 1971, p. 2619.

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