Component lead bending apparatus

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29838, 29739, 140105, B23P 2100

Patent

active

044648294

ABSTRACT:
The leads of an IC module are bent to secure the module to a printed circuit board by a pair of rotatable bending members driven concurrently by a camming member which rotates about an axis normal to the axes of rotation of the bending members. Cam follower projections from the bending members engage spiral cam slots in the camming member. The slots spiral away from the axis of rotation of the camming member. All of the above structures are beneath the circuit board and above the lap of an operator who places the module on the board from above the board.

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patent: 4218817 (1980-08-01), Takano
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patent: 4377026 (1983-03-01), Whitley

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