Component interconnect with substrate shielding

Details Component interconnect with substrate shielding Component interconnect with substrate shielding

2004-06-30

2008-08-12

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Superconductive contact or lead

Transmission line or shielded

C257S663000, C257S664000, C257SE23114, C257S531000, C333S247000

Reexamination Certificate

active

07411279

ABSTRACT:
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive layers may be disposed on respective portions of the first and second surfaces. A first conductor, having an end, may be disposed on a surface of the first dielectric layer, including at least a first portion extending around at least a portion of the conductor end. The second conductive layer may line the channel extending around a portion of the conductor end. Some examples may include a stripline having a second conductor connected to the first conductor. Some examples may include a cover having a wall positioned on the first dielectric over the second conductor.

REFERENCES:
patent: 3370256 (1968-02-01), Baur et al.
patent: 3613230 (1971-10-01), Griff
patent: 4394633 (1983-07-01), Klein
patent: 4460880 (1984-07-01), Turner
patent: 4673904 (1987-06-01), Landis
patent: 4776087 (1988-10-01), Cronin et al.
patent: 4801905 (1989-01-01), Becker
patent: 4845311 (1989-07-01), Schreiber et al.
patent: 5294751 (1994-03-01), Kamada
patent: 5317292 (1994-05-01), Leeb
patent: 5426399 (1995-06-01), Matsubayashi et al.
patent: 5453154 (1995-09-01), Thomas et al.
patent: 5461353 (1995-10-01), Eberhardt
patent: 5532658 (1996-07-01), Tonegawa et al.
patent: 5574415 (1996-11-01), Peterson
patent: 5581217 (1996-12-01), Macdonald
patent: 5796165 (1998-08-01), Yoshikawa et al.
patent: 5828555 (1998-10-01), Itoh
patent: 5830797 (1998-11-01), Cleeves
patent: 5854867 (1998-12-01), Lee et al.
patent: 5880657 (1999-03-01), Dorschky et al.
patent: 6000120 (1999-12-01), Arledge et al.
patent: 6239669 (2001-05-01), Koriyama et al.
patent: 6268283 (2001-07-01), Huang
patent: 6268637 (2001-07-01), Gardner et al.
patent: 6274920 (2001-08-01), Park et al.
patent: 6356173 (2002-03-01), Nagata et al.
patent: 6417744 (2002-07-01), Albinsson et al.
patent: 6483406 (2002-11-01), Sawa et al.
patent: 6486755 (2002-11-01), Aruga
patent: 6495903 (2002-12-01), Xu et al.
patent: 6515222 (2003-02-01), Underwood et al.
patent: 6617686 (2003-09-01), Davies
patent: 6646526 (2003-11-01), Kinayman et al.
patent: 6653915 (2003-11-01), Arledge et al.
patent: 6731009 (2004-05-01), Jones et al.
patent: 6787893 (2004-09-01), Nakajima et al.
patent: 2002/0056888 (2002-05-01), Depetro
patent: 2003/0001252 (2003-01-01), Ku et al.
patent: 2003/0015772 (2003-01-01), Ivanov et al.
patent: 2003/0064547 (2003-04-01), Akram et al.
patent: 2003/0071325 (2003-04-01), Xu et al.
patent: 2003/0132821 (2003-07-01), Otsuka et al.
patent: 2003/0224553 (2003-12-01), Manansala
patent: 2004/0155723 (2004-08-01), Koriyama
patent: 155025 (1902-11-01), None
patent: 1 243 764 (1971-08-01), None
patent: 63-129632 (1988-06-01), None
patent: 1146426 (1989-06-01), None
patent: 3041803 (1991-02-01), None
patent: 3211870 (1991-09-01), None
patent: 4-139783 (1992-05-01), None
patent: 4294602 (1992-10-01), None
patent: WO92/22939 (1992-12-01), None

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