Component incorporating module

Details Component incorporating module Component incorporating module

2011-02-08

2011-02-08

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000, C361S764000, C361S782000

Reexamination Certificate

active

07885081

ABSTRACT:
A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.

REFERENCES:
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 6002592 (1999-12-01), Nakamura et al.
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6338767 (2002-01-01), Nakatani et al.
patent: 6489685 (2002-12-01), Asahi et al.
patent: 6625037 (2003-09-01), Nakatani et al.
patent: 7068519 (2006-06-01), Nakatani et al.
patent: 7315455 (2008-01-01), Furukawa et al.
patent: 2003/0087538 (2003-05-01), Ueno
patent: 2004/0160752 (2004-08-01), Yamashita et al.
patent: 2005/0045369 (2005-03-01), Ishimaru et al.
patent: 2002-076637 (2002-03-01), None
patent: 2002-223076 (2002-08-01), None
patent: 2005-039158 (2005-02-01), None
patent: 2006-303202 (2006-11-01), None
Official communication issued in the International Application No. PCT/JP2006/315389, mailed on Aug. 29, 2006.
Official Communication issued in corresponding Japanese Patent Application No. 2007-536418, mailed on Sep. 7, 2010.

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