Component holding head, component mounting apparatus using...

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S720000, C029S721000, C029S832000, C029S833000, C356S401000, C356S622000, C294S064200

Reexamination Certificate

active

07114245

ABSTRACT:
An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic component having a positioning mark formed on a film member. The electronic component holding head has a main electronic component holding unit, a vacuum chucking part facing the surface of the electronic component to be held by vacuum chucking so as to hold the electronic component, and a light path for guiding light shined onto a positioning mark formed at an edge part of the electronic component for the purpose of correcting a position offset between the electronic component and the substrate to which the electronic component is to be mounted, the vacuum chucking part holding the electronic component at a position which is on a straight line substantially parallel to an edge of the electronic component and substantially mutually orthogonal over the positioning mark of the electronic component, and which avoids the positioning mark.

REFERENCES:
patent: 5501004 (1996-03-01), Onitsuka
patent: 6100922 (2000-08-01), Honda et al.
patent: 6193132 (2001-02-01), Shibata et al.
patent: 6203082 (2001-03-01), Bendat et al.
patent: 6649926 (2003-11-01), Suhara et al.

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