Coating processes – Electrical product produced – Condenser or capacitor
Reexamination Certificate
2006-06-27
2006-06-27
Talbot, Brian K. (Department: 1762)
Coating processes
Electrical product produced
Condenser or capacitor
C427S080000, C427S304000, C427S437000, C427S443100, C029S025410, C029S025420, C205S126000
Reexamination Certificate
active
07067172
ABSTRACT:
Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material. Such plated material may ultimately form generally round portions of ball limiting metallurgy (BLM) to which solder balls may be reflowed. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and materials may be employed in the formation of the subject self-determining plated terminations and inductive components.
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Dattaguru Sriram
Galvagni John L.
Heistand, II Robert
MacNeal Jason
Ritter Andrew P.
AVX Corporation
Dority & Manning P.A.
Talbot Brian K.
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