Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-01-03
2008-10-14
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C438S106000
Reexamination Certificate
active
07436051
ABSTRACT:
A component for fabricating the electronic device comprises a substrate and a conductive film provided on the substrate, in which the adhesion of the conductive film to the substrate is not greater than 0.1 N/cm. The adhesion of the conductive film to the substrate is weak enough to enable the conductive film to be readily peeled from the substrate. This makes it possible to form a component on a substrate other than the substrate used during film formation, thereby greatly increasing the degree of product configuration freedom. If the adhesion of a lower conductive film on the substrate side is made to be not greater than 0.04 N/cm, it becomes very easy to peel the conductive film from the substrate.
REFERENCES:
patent: 7042090 (2006-05-01), Noguchi et al.
patent: 7080446 (2006-07-01), Baba et al.
patent: 2001/0041261 (2001-11-01), Tozuka et al.
patent: 2002/0102791 (2002-08-01), Kurasawa et al.
patent: 10-134634 (1998-04-01), None
patent: 2003204167 (2003-07-01), None
patent: 2004363118 (2004-12-01), None
Office Action dated Jul. 20, 2007, in the corresponding Chinese Application (6pgs).
Noguchi Takao
Saito Hisatoshi
Jackson Jerome
TDK Corporation
Valentine Jami M
Young Law Firm P.C.
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