Component for being subjected to high thermal load during...

Details Component for being subjected to high thermal load during... Component for being subjected to high thermal load during...

2007-11-27

2007-11-27

Rodriguez, William H. (Department: 3746)

Power plants

Reaction motor

Liquid oxidizer

C060S266000

Reexamination Certificate

active

10710108

ABSTRACT:
Method and arrangement for providing a component (1) for being subjected to high thermal load during operation. The component includes a wall structure, which defines an inner space for gas flow. The component is formed by at least a first part (5) that includes an inner wall (8), an outer wall (9) and at least one cooling channel (11) between the walls. An end portion of said inner wall of the first part of the component is joined to a second part (6). The joint (18) is located at a distance from the interior of the component.

REFERENCES:
patent: 3066702 (1962-12-01), Tumavicus
patent: 3126702 (1964-03-01), Newcomb
patent: 3224678 (1965-12-01), Rosman
patent: 3605412 (1971-09-01), Stockel et al.
patent: 3630449 (1971-12-01), Butler
patent: 3695515 (1972-10-01), Stockel
patent: 4055044 (1977-10-01), Dederra et al.
patent: 4369920 (1983-01-01), Schmidt
patent: 4555901 (1985-12-01), Wakeman et al.
patent: 4622821 (1986-11-01), Madden
patent: 4655044 (1987-04-01), Dierberger et al.
patent: 5333443 (1994-08-01), Halila
patent: 5363643 (1994-11-01), Halila
patent: 5435139 (1995-07-01), Pidcock et al.
patent: 5467528 (1995-11-01), Bales et al.
patent: 5479774 (1996-01-01), Burnell et al.
patent: 5704208 (1998-01-01), Brewer et al.
patent: 5765360 (1998-06-01), Schmidt et al.
patent: 5799491 (1998-09-01), Bell et al.
patent: 5832719 (1998-11-01), Riccardi
patent: 6107596 (2000-08-01), Semenov et al.
patent: 6701714 (2004-03-01), Burd et al.
patent: 6920750 (2005-07-01), Haggander et al.
patent: 6945032 (2005-09-01), Lundgren

Affiliated with

Also associated with

Rating

Component for being subjected to high thermal load during... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component for being subjected to high thermal load during..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component for being subjected to high thermal load during... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3867117