Component fixing method

Details Component fixing method Component fixing method

2011-02-01

2011-02-01

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S852000, C029S840000, C029S025410, C361S807000

Reexamination Certificate

active

07877867

ABSTRACT:
A resist having a predetermined thickness is formed on a printed circuit board except for portions of the printed circuit board that oppose a convex portion of a component when the component is mounted on the printed circuit board. A silk screen printed layer having a predetermined thickness is formed on the resist. Thereafter, a concave portion of the component is bonded to the silk screen printed layer using double coated tape having a predetermined thickness. The component is mounted such that the convex portions of the component oppose the portions of the printed circuit board that do not have a resist formed thereon. The sum of the thicknesses of the resist, the silk screen printed layer and the double coated tape is larger than a height difference between the concave portion and the convex portion of the component.

REFERENCES:
patent: 4572843 (1986-02-01), Saito et al.
patent: 6225133 (2001-05-01), Yamamichi et al.
patent: 6998696 (2006-02-01), Casper et al.
patent: 7100277 (2006-09-01), Borland et al.
patent: 7586754 (2009-09-01), Kawamura
patent: 2008/0285246 (2008-11-01), Kawamura
patent: 4-247685 (1992-09-01), None

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