Component engaging apparatus

Details Component engaging apparatus Component engaging apparatus

1980-03-05

1981-12-29

Baldwin, Robert D.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

With means to treat workpieces

228 6A, B23K 3100, H01L 2198

Patent

active

043078320

ABSTRACT:
An improved component engaging apparatus for mounting electrical and electronic components or the like onto a circuit board or substrate which includes a bonding agent applying unit for applying the bonding agent onto the substrate, a chip component mounting section for mounting electronic parts onto the bonding agent on the substrate, a chip component feeding section for sequentially feeding the chip components, a driving section for the chip component feeding section, and a substrate support section which is arranged to alter its position with respect to the chip component mounting section and bonding agent applying section.

REFERENCES:
patent: 3731867 (1973-05-01), Frisbie et al.
patent: 3920949 (1975-11-01), Clawson et al.
patent: 3964664 (1976-06-01), Butler et al.
patent: 4166562 (1979-09-01), Keizer et al.

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