Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-04-25
2000-07-25
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361687, 361688, 361690, 361691, 361692, 361693, 361694, 361695, 361696, 361697, 361720, 361809, 307150, 174 161, 165 803, H05K 720
Patent
active
060943459
ABSTRACT:
In a modern computer, heat is removed from the internal power supply unit by means of a fan and ducting for channeling the airflow created by the fan through the circuitry of the power supply unit. The fan draws part of its air supply from the ambient air inside the computer casing and this helps to cool other components of the computer such as the microprocessor. As the power of microprocessors increases, the cooling requirement for this component has increased and heat sinks have been utilised to increase heat transfer to the surrounding air. Whilst further augmentation of heat removal could be achieved by increasing the power of the cooling fan, this would also increase noise levels. The present arrangement provides for increased heat removal without increasing fan power by arranging for the microprocessor heat sink to project into the ducting used to channel cooling air over the circuitry of the power supply unit.
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patent: 5523917 (1996-06-01), Searby
patent: 5691883 (1997-11-01), Nelson
Patent Abstracts of Japan vol. 013, No. 142 (E-739), Apr. 7, 1989 & JP-A-63 302736 (Fuji Electric Co Ltd), Dec. 9, 1988 *abstract*.
Patent Abstracts of Japan vol. 014, No. 041 (E-0879), Jan. 25, 1990 & JP-A-01 273395 (NEC Corp), Nov. 1, 1989 *abstract*.
IBM Technical Disclosure Bulletin, vol. 25, No. 7b, Dec. 1982, New York US, pp. 3906-3908, XP002018366 "Induced Cooling in a Unit Cooling Scheme" *the whole document*.
Datskovsky Michael
Hewlett--Packard Company
Picard Leo P.
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