Component cooling arrangement in electronic equipment with inter

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361687, 361688, 361690, 361691, 361692, 361693, 361694, 361695, 361696, 361697, 361720, 361809, 307150, 174 161, 165 803, H05K 720

Patent

active

060943459

ABSTRACT:
In a modern computer, heat is removed from the internal power supply unit by means of a fan and ducting for channeling the airflow created by the fan through the circuitry of the power supply unit. The fan draws part of its air supply from the ambient air inside the computer casing and this helps to cool other components of the computer such as the microprocessor. As the power of microprocessors increases, the cooling requirement for this component has increased and heat sinks have been utilised to increase heat transfer to the surrounding air. Whilst further augmentation of heat removal could be achieved by increasing the power of the cooling fan, this would also increase noise levels. The present arrangement provides for increased heat removal without increasing fan power by arranging for the microprocessor heat sink to project into the ducting used to channel cooling air over the circuitry of the power supply unit.

REFERENCES:
patent: 5424915 (1995-06-01), Katooka et al.
patent: 5440450 (1995-08-01), Lau
patent: 5523917 (1996-06-01), Searby
patent: 5691883 (1997-11-01), Nelson
Patent Abstracts of Japan vol. 013, No. 142 (E-739), Apr. 7, 1989 & JP-A-63 302736 (Fuji Electric Co Ltd), Dec. 9, 1988 *abstract*.
Patent Abstracts of Japan vol. 014, No. 041 (E-0879), Jan. 25, 1990 & JP-A-01 273395 (NEC Corp), Nov. 1, 1989 *abstract*.
IBM Technical Disclosure Bulletin, vol. 25, No. 7b, Dec. 1982, New York US, pp. 3906-3908, XP002018366 "Induced Cooling in a Unit Cooling Scheme" *the whole document*.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Component cooling arrangement in electronic equipment with inter does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component cooling arrangement in electronic equipment with inter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component cooling arrangement in electronic equipment with inter will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1341076

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.