Component connections using bumps and wells

Details Component connections using bumps and wells Component connections using bumps and wells

2005-04-19

2005-04-19

Thompson, Craig A. (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

06881609

ABSTRACT:
This specification describes techniques for fabricating connections between pairs of components. Each connection includes an array of bumps on a male component, and a matching array of wells filled with bonding material on a female component. The bump/well connections can be spaced with a pitch of less than 100 microns. One application of the invention is the attachment of electronic components to interconnection circuits or circuit assemblies to form electronic modules. The electronic components may be IC chips or high-density interconnect cables. Another application is alignment of optical components. The direct chip attachment techniques are described in the context of fabrication, assembly, test, rework, and cooling of electronic modules employing flip chip components. The preferred method is to fabricate the module on a glass carrier using a release layer so that the carrier can be removed after most of the processing is done.

REFERENCES:
patent: 5214250 (1993-05-01), Cayson et al.
patent: 5267867 (1993-12-01), Agahdel et al.
patent: 5290970 (1994-03-01), Currie
patent: 5367593 (1994-11-01), Lebby et al.
patent: 5579574 (1996-12-01), Colleran et al.
patent: 5627406 (1997-05-01), Pace
patent: 5972152 (1999-10-01), Lake et al.
patent: 5998738 (1999-12-01), Li et al.
patent: 6103554 (2000-08-01), Son et al.
patent: 6246010 (2001-06-01), Zenner et al.
patent: 6372549 (2002-04-01), Urushima
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6528891 (2003-03-01), Lin

Affiliated with

Also associated with

Rating

Component connections using bumps and wells does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component connections using bumps and wells, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component connections using bumps and wells will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3412568