Component connection system

Details Component connection system Component connection system

1974-10-10

1978-06-20

McGlynn, Joseph H.

Geometrical instruments

H01R 1328

Patent

active

040958671

ABSTRACT:
The following specification illustrates a stack including one or more interconnect wafer screens and a connector wafer screen having active circuit components detachably secured thereto by means of a component wafer interconnected with the stack through a connector wafer screen and against which pressure is applied by a coupon pressure cap on tightening a bolt extending through the stack. A dual inline package is also shown detachably secured to a printed circuit board by means of a wafer against which pressure is applied to effect connections between the printed circuit board conductive segments and the package terminals.

REFERENCES:
patent: 2853656 (1958-09-01), Dowds
patent: 3705332 (1972-12-01), Parks
IBM Technical Bulletin, Beverly et al., Multilayer Electronic Package, 1966-03, pp. 1325 & 1326, vol. 8, No. 10.

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