Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-07-08
1989-10-10
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
174 524, 361395, H01R 2372
Patent
active
048728446
ABSTRACT:
An adapter substrate (40) for carrying one or more electrical components (80,90), includes plated circuitry to which the components are connectable, to comprise a member securable between a chip carrier socket (20) and a printed circuit panel (14) and provide electrical interconnection therebetween. The electrical components are connected to selected ones of the interconnections between the socket and the panel in order to modify, effect or sense the selected interconnections. While the other interconnections are passed through the substrate such as by plated through-holes (44), the selected interconnections are interrupted by the dielectric material of the substrate (40) and are plated blind holes (46) connected by path segments (120) to be electrically connected to the one or more electrical components; completing the connection to the socket's contacts are plated through-holes (116) and path segments (128) to contact pads (52). Into the plated through-holes and plated blind holes alike can be inserted post members (42) matable with plated through-holes (16) of the panel; contact sections connectable with the socket's contacts (28 ) can be pads (52) for surface mounting. One such adapter can be used to fabricate an assured backup power supply (10) for an IC chip carried in the socket (20), when a battery (80) and a logic chip control circuit (90) therefor are the electrical components.
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1988, Data Book, Dallas Semiconductor Corp., pp. 20-23, 227-237, and 609-612; Dallas Semiconductor Corp., Dallas, Tex.
AMP Catalog 87-798, Issued 5-87, "IC Sockets", p. 35; AMP Incorporated, Harrisburg, Pa.
Grebe Robert K.
Lucius John E.
Szczesny David S.
Abrams Neil
AMP Incorporated
Ness Anton P.
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