Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1998-06-02
2000-11-21
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257786, 257700, 257758, 257668, 257701, 257778, H05K 111, H01L 2348, H01L 2962, H01L 2940, H01L 2352
Patent
active
061507261
ABSTRACT:
Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
REFERENCES:
patent: 4710798 (1987-12-01), Marcantonio
patent: 5281151 (1994-01-01), Arima et al.
patent: 5360988 (1994-11-01), Uda et al.
patent: 5367403 (1994-11-01), Yamamoto et al.
patent: 5367435 (1994-11-01), Andros et al.
patent: 5375042 (1994-12-01), Arima et al.
patent: 5378926 (1995-01-01), Chi et al.
patent: 5381039 (1995-01-01), Morrison
patent: 5399898 (1995-03-01), Rostoker
patent: 5400220 (1995-03-01), Swamy
patent: 5434452 (1995-07-01), Higgins, III
patent: 5436203 (1995-07-01), Lin
patent: 5450283 (1995-09-01), Lin et al.
patent: 5523622 (1996-06-01), Harada et al.
patent: 5635767 (1997-06-01), Wenzel et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5652466 (1997-07-01), Hirakawa et al.
patent: 5654590 (1997-08-01), Kuramochi
patent: 5661341 (1997-08-01), Neftin
patent: 5672911 (1997-09-01), Patil et al.
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5734560 (1998-03-01), Kamperman et al.
patent: 5763939 (1998-06-01), Yamashita
patent: 5773882 (1998-06-01), Iwasaki
patent: 5777383 (1998-07-01), Stager et al.
patent: 5786630 (1998-07-01), Bhansali et al.
Feilchenfeld Natalie Barbara
Fuerniss Stephen Joseph
Gaynes Michael Anthony
Hoontrakul Pat
Pierson Mark Vincent
International Business Machines Corp.
Pivnichny John R.
Williams Alexander Oscar
LandOfFree
Component carrier with raised bonding sites does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Component carrier with raised bonding sites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component carrier with raised bonding sites will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1260214