Component attach methods and related device structures

Details Component attach methods and related device structures Component attach methods and related device structures

2011-08-09

2011-08-09

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257S723000

Reexamination Certificate

active

07993940

ABSTRACT:
A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method includes disposing an attachment material layer over a surface, providing the component having a backside surface, disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer, and moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer. The attachment material can include a solder. A light-emitting device is also described that comprises a component including a light-emitting die, wherein the component is supported by a substrate, and wherein the light-emitting die comprises a light emission surface and a backside surface disposed opposite the light emission surface. The light emission surface of the light-emitting die has an area greater than or equal to 1 mm2and an attachment material layer is disposed between the backside surface of the light-emitting die and the substrate, wherein the attachment material layer has voiding of less than 5% of an area of the backside surface.

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