Component assembly cushioning device for mobile devices

Details Component assembly cushioning device for mobile devices Component assembly cushioning device for mobile devices

2007-08-14

2007-08-14

Lee, Jinhee (Department: 2174)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C174S351000, C174S370000, C174S371000, C174S373000, C174S353000, C174S387000

Reexamination Certificate

active

10890325

ABSTRACT:
A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.

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patent: 2 383 472 (2003-06-01), None
IBM Technical Disclosure Bullentin, IBM Corp. New York, US, “Floating Subassemblies With Impact Absorbing Foam”, vol. 37, No. 7, Jul. 1, 1994, pp. 187-188.

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