Component assembly

Details Component assembly Component assembly

2009-05-12

2011-12-20

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S303000, C361S773000, C361S782000

Reexamination Certificate

active

08081485

ABSTRACT:
A component assembly includes an electric component with a body and a carrier substrate on which the component is fixed by means of a conductive adhesive layer. External electrical contacts that have a planar surface are arranged on the lower side of the body. The conductive adhesive acts upon the body in at least one contact region that is devoid of the external electrical contacts.

REFERENCES:
patent: 5931371 (1999-08-01), Pao et al.
patent: 5936846 (1999-08-01), Jairazbhoy et al.
patent: 6326239 (2001-12-01), Asai et al.
patent: 6380619 (2002-04-01), Ahiko et al.
patent: 6807047 (2004-10-01), Togashi et al.
patent: 6965507 (2005-11-01), Togashi et al.
patent: 7359178 (2008-04-01), Feichtinger
patent: 2003/0103320 (2003-06-01), Shimada et al.
patent: 199 15 745 (1999-10-01), None
patent: 101 32 798 (2003-01-01), None
patent: 10 2004 016 146 (2005-10-01), None
patent: 10 2005 016 590 (2006-10-01), None
patent: 2000-124059 (2000-04-01), None
patent: 2004-228544 (2004-08-01), None
patent: 2004-278508 (2004-10-01), None
patent: 2006-216781 (2006-08-01), None
“Multilayer Ceramic Capacitors,” Data Book 2003, Edition Nov. 2002, 4 pages, www.epcos.com.

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