Component and solder preform placement device and method of plac

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156230, 156290, 156285, 156 736, 228245, 228246, 228 563, B23K 1700, B23K 2000

Patent

active

052058964

ABSTRACT:
Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.

REFERENCES:
patent: 3355078 (1967-11-01), Smith
patent: 3516155 (1970-06-01), Smith
patent: 3899379 (1975-08-01), Wanesky
patent: 4209893 (1980-07-01), Dyce
patent: 4216350 (1980-08-01), Reid
patent: 4462534 (1984-07-01), Bitaillou
patent: 4774760 (1988-10-01), Seaman
patent: 4871110 (1989-10-01), Fukasawa
patent: 4898320 (1990-02-01), Dunaway
patent: 5118027 (1992-06-01), Braun

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