Compliant thermally conductive compound

Details Compliant thermally conductive compound Compliant thermally conductive compound

1988-05-13

1992-03-10

Barr, Josephine

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

252623T, 252372, 252573, 252574, 252 73, 252 74, 252 75, 252 77, 252 781, 252 783, B09K 500, H01B 320

Patent

active

050947699

ABSTRACT:
A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

REFERENCES:
patent: 3405066 (1968-10-01), McGhee et al.
patent: 3495133 (1970-02-01), Miller
patent: 3882033 (1975-05-01), Wright
patent: 4265775 (1981-05-01), Aakalu
IBM Technical Disclosure Bulletin, vol. 25, No. 11A, 4/83, pp. 5740-5743, "Flexible Heat-Conducting Sheet Material for Semiconductor Packages" R. H. Lacombe et al.
IBM Technical Disclosure Bulletin, vol. 25, No. 10, 3/83, p. 5322, "Heat Transfer Compound" E. R. Mondou.
IBM Technical Disclosure Bulletin, vol. 24, No. 7A, 12/81, p. 3530, "Thermal Grease With Boron or Aluminum Nitride and Mineral Oil", N. G. Aakalu et al.

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