Compliant thermal interface structure with vapor chamber

Details Compliant thermal interface structure with vapor chamber Compliant thermal interface structure with vapor chamber

2007-09-04

2007-09-04

Walberg, Teresa J. (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080400

Reexamination Certificate

active

11151831

ABSTRACT:
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion, provides a heat path from the electronic device and provides mechanical compliance. The structure further includes a seal for containing a space between the top layer and the electronic device, wherein the space contained includes the plurality of spring elements, and a liquid with vaporizing capability disposed with the space contained.

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patent: 2001/0042638 (2001-11-01), Yamada et al.

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