Compliant thermal interface structure utilizing spring elements

Details Compliant thermal interface structure utilizing spring elements Compliant thermal interface structure utilizing spring elements

2008-04-08

2008-04-08

Hyeon, Hae Moon (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000

Reexamination Certificate

active

11151830

ABSTRACT:
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.

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