Compliant thermal interface structure utilizing spring elements

Details Compliant thermal interface structure utilizing spring elements Compliant thermal interface structure utilizing spring elements

2008-04-08

2008-04-08

Hyeon, Hae Moon (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000

Reexamination Certificate

active

07355855

ABSTRACT:
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.

REFERENCES:
patent: 5528456 (1996-06-01), Takahashi
patent: 5548090 (1996-08-01), Harris
patent: 6259602 (2001-07-01), Malhammar
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6411513 (2002-06-01), Bedard
patent: 6528878 (2003-03-01), Daikoku et al.
patent: 6894908 (2005-05-01), Clark et al.
patent: 6898082 (2005-05-01), Dessiatoun et al.
patent: 6903929 (2005-06-01), Prasher et al.
patent: 7019395 (2006-03-01), Hirano et al.
patent: 7019971 (2006-03-01), Houle et al.
patent: 7028761 (2006-04-01), Lee et al.
patent: 2006/0278371 (2006-12-01), Karidis et al.
patent: 2006/0279932 (2006-12-01), Karidis et al.

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