Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-06-14
2008-08-05
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S699000, C361S702000, C361S703000, C361S704000, C361S707000, C361S711000, C165S080200, C165S080300, C165S080400
Reexamination Certificate
active
07408780
ABSTRACT:
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.
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Karidis John P.
Schultz Mark D.
Webb Bucknell C.
Alexanian Vazken
Buchenhorner Michael U.
Gandhi Jayprakash N
Haughton Anthony M
International Business Machines - Corporation
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