Compliant thermal cap for an electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S707000, C257S706000, C257S707000, C257S718000

Reexamination Certificate

active

10919180

ABSTRACT:
A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion and wherein the compliant cap comprises a thermally conducting material.

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patent: 2004/0144996 (2004-07-01), Inoue

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