Compliant standoff for semiconductor packages

Details Compliant standoff for semiconductor packages Compliant standoff for semiconductor packages

1988-02-01

1989-03-28

James, Andrew J.

357 72, 357 68, H01L 2312, H01L 2314

Patent

active

048168963

ABSTRACT:
Described herein is a standoff for use with semiconductor packages to prevent chipping. The standoff is designed to fit over a pin of the package and seat on the package surface with a portion extending over the corner of the package.

REFERENCES:
patent: 4742385 (1988-05-01), Kohmoto

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