Compliant solder interconnection

Details Compliant solder interconnection Compliant solder interconnection

1991-04-04

1992-02-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165185, 228248, 337232, 361403, H05K 720

Patent

active

050880071

ABSTRACT:
An improved interconnection for mounting an electrical component to a substrate, such as a printed circuit board or the like, comprises an interwoven copper film mat embedded within a solder alloy matrix. The solder alloy is bonded to the component and to the substrate and extends continuously therebetween to provide a strong mechanical joint. The copper mat enhances electrical and thermal conductivity through the interconnection and improves compliant to relieve stresses of the type generated by differential thermal expansion of the component and the substrate during use.

REFERENCES:
patent: 3781513 (1973-12-01), Bennett
patent: 3969754 (1976-07-01), Kuniya
patent: 4290195 (1981-09-01), Rippere
patent: 4740252 (1988-04-01), Hasegawa
patent: 4922068 (1990-05-01), Bangs
patent: 4937435 (1990-06-01), Goss
patent: 4978814 (1990-12-01), Honour
Tumala, R. R., et al., Microelectronics Packaging Handbook (1989), pp. 803-835.

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