Compliant pre-form interconnect

Details Compliant pre-form interconnect Compliant pre-form interconnect

2005-08-02

2005-08-02

Mayes, Melvin C. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S235000, C156S289000, C156S293000, C156S306900, C439S091000

Reexamination Certificate

active

06923882

ABSTRACT:
An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

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Brian Bauer and Rick Lathrop, “An Introduction to Solder Materials,” Technical Papers, Heraeus Incorporated, 1999.

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