Compliant penetrating packaging interconnect

Details Compliant penetrating packaging interconnect Compliant penetrating packaging interconnect

2011-03-01

2011-03-01

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S803000, C029S830000

Reexamination Certificate

active

07897878

ABSTRACT:
A circuit package is provided. The circuit package includes a plurality of electrically conductive pads located on a bottom surface of the circuit package, wherein at least one pad of the plurality of bottom surface pads has a recession for receiving an electrically conductive protrusion located on a substrate to which the circuit package is to be mounted.

REFERENCES:
patent: 6188028 (2001-02-01), Haba et al.
patent: 6259155 (2001-07-01), Interrante et al.
patent: 6559666 (2003-05-01), Bernier et al.
patent: 2005/0143534 (2005-06-01), Dueber et al.
“Ceramic Column Grid Array Package”, Application Note, Actel, Sep. 2003, 7 pgs.
“Land grid array sockets for server applications”, J.S. Corbin et al., IBM Journal of Research and Development, vol. 46, No. 6, Nov. 2002, pp. 763-778.

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