Compliant pad for use in tape automated bonding process

Details Compliant pad for use in tape automated bonding process Compliant pad for use in tape automated bonding process

1988-09-29

1989-07-18

Seidel, Richard K.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Including compliant cushioning medium

228106, B23K 112, H01L 21603

Patent

active

048486396

ABSTRACT:
A compliant pad or work piece for use in bonding the inner leads of integrated circuit devices as a part of a tape automated bonding process. The work piece is constructed of a metallic base layer to which is affixed a compliant pad, a cap support and a cap positioned on said compliant pad surrounding a gas channel which is connected to a source of gas such as nitrogen. A ceramic heat distribution layer is positioned over said gas channel and acts to support the integrated circuit device to be bonded to an associated tape during the tape automated bonding process.

REFERENCES:
patent: 3627190 (1971-12-01), Ramsey
patent: 3998377 (1976-12-01), Metz
patent: 4638937 (1987-01-01), Belanger, Jr.

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