Compliant mat cooling

Details Compliant mat cooling Compliant mat cooling

1977-01-03

1979-05-22

Myhre, Charles J.

Heat exchange

Flexible envelope or cover type

165105, 361368, 174 16HS, H05K 720, F28F 700

Patent

active

041554027

ABSTRACT:
A printed circuit board package for high density packaging of electronic circuit components is disclosed. The circuit components are cooled by a liquid cooled, cold plate with a compliant mat interface. The interface is made of a heat conductive, electrically insulative compliant structure, such that uniform contact can be made with the circuit components, even if there are differences in the relative heights and shapes of the components.

REFERENCES:
patent: 3593064 (1971-07-01), Wagner
patent: 3689804 (1972-09-01), Ishihama et al.
patent: 4072188 (1978-02-01), Wilson et al.
IBM Technical Disclosure Bulletin (vol. 20#5), Oct. 1977 (pp. 1966 & 1967).

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