Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-11-16
2004-11-09
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S748000, C361S760000, C361S777000, C174S255000, C174S263000
Reexamination Certificate
active
06816385
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates generally to semiconductor manufacture, and more particularly, to the connection of an electronic device to external circuitry.
2. Related Art
As illustrated in
FIG. 1
, which depicts a related art module a printed circuit card
12
is conventionally connected to a substrate
14
, such as a chip package, using a plurality of solder ball connections
16
. However, because the card
12
and the substrate
14
expand at different rates when exposed to a thermal stimulus, due to the difference in the coefficient of thermal expansion (CTE) of each, stresses are created within the solder ball connections
16
which often lead to solder ball fatigue, and subsequently result in failure of the module
10
. This is particularly problematic in ceramic, glass/ceramic and aluminum/ceramic modules. Also, due to the flexibility of organic substrate modules, thermal-driven warpage may further exacerbate the problem. Accordingly, there exists a need in the industry to solve these and other problems.
SUMMARY OF THE INVENTION
A first general aspect of the present invention provides an electronic device, comprising: a first substrate; a second substrate; and a flexible connector attached between the first and second substrates by a plurality of contacts on a first and a second surface of the connector.
A second general aspect of the present invention provides a connector system, comprising: a flexible substrate; a plurality of contacts formed on a first surface of the substrate; and a plurality of contacts formed on a second surface of the substrate, wherein select contacts on the first surface of the substrate are off-set from select contacts on the second surface of the substrate.
A third general aspect of the present invention provides a method of forming an electronic device, comprising: providing a flexible connector having a plurality of contacts on a first surface and a plurality of contacts on a second surface; and attaching the flexible connector between a first substrate and a second substrate via the contacts.
A fourth general aspect of the present invention provides a method of forming an electronic device, comprising: providing a first substrate; providing a second substrate; providing a flexible connector having a plurality of contacts on a first surface of the connector and a plurality of contacts on a second surface of the connector, wherein select contacts on the first and second surface of the connector are off-set; and attaching the contacts on the first surface of the connector to the first substrate and the contacts on the second surface of the connector to the second substrate.
The foregoing and other features of the invention will be apparent from the following more particular description of the embodiments of the invention.
REFERENCES:
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Peterson et al., IBM Technical Disclosure Bulletin, “Thermally Enhanced Three-Dimensional Flex Interconnectof Multi-Chip Modules,” vol. 36, No. 12, Dec. 1993, p. 39.
Nakamura et al., 2000 International Symposium on Microelect, “Multilayer Substrate with Low Coefficent of Thermal Expansion,” pp. 235-240.
Lindinger Michael L.
Martin David
Schmeiser Olsen & Watts
Steinberg William H.
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