Compliant electrically connective bumps for an adhesive flip chi

Details Compliant electrically connective bumps for an adhesive flip chi Compliant electrically connective bumps for an adhesive flip chi

1994-02-14

1996-04-16

Hearn, Brian

Fishing, trapping, and vermin destroying

437189, 437192, 437203, H01L 2144

Patent

active

055082289

ABSTRACT:
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

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