Compliant contact integrator

Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...

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439 66, H01R 458

Patent

active

058937650

ABSTRACT:
A contact integrator for supporting a die in a semiconductor package and for providing an electrical pathway from the semiconductor package to one or more bonding pads on the die is provided. The contact integrator includes a substrate that has one or more conductor trace for interconnection to the semiconductor package. A Z-elastomer member is disposed on the substrate. An insulating member is disposed on the Z-elastomer member. One or more conductor rods are coupled to the insulating member. Each of the conductor rods has a first end adapted to contact one of the bonding pads and a second end adapted to contact the Z-elastomer member. The conductor rods are respectively substantially vertically aligned with the bonding pads and the conductor traces, and are capable of longitudinal movement relative to the insulating member.

REFERENCES:
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5155905 (1992-10-01), Miller, Jr.
patent: 5171290 (1992-12-01), Olla et al.
patent: 5249450 (1993-10-01), Wood et al.
patent: 5282111 (1994-01-01), Hopfer
patent: 5367253 (1994-11-01), Wood et al.
patent: 5473510 (1995-12-01), Dozier, II
patent: 5483174 (1996-01-01), Hembree et al.
patent: 5636996 (1997-06-01), Johnson et al.

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