Compliant bump technology

Details Compliant bump technology Compliant bump technology

1997-04-03

1998-07-21

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438118, H01L 2160

Patent

active

057834652

ABSTRACT:
The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.

REFERENCES:
patent: 4941255 (1990-07-01), Bull
patent: 5326671 (1994-07-01), Brown et al.
patent: 5578527 (1996-11-01), Chang et al.
patent: 5668059 (1997-09-01), Christie et al.

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