Compliant bonding method

Details Compliant bonding method Compliant bonding method

1975-01-13

1976-08-10

Baldwin, Robert D.

Metal fusion bonding

Process

Using a compliant cushioning medium

228 55, B23K 100

Patent

active

039737144

ABSTRACT:
Compliant bonding of successive beam-lead semiconductor devices to successive metallic patterns on substrates is accomplished with a bonding apparatus that uses an indexable compliant member. A bonding head of the apparatus is provided with a single movable tip which disengages from the compliant member during indexing of the member. The movable tip engages with a portion of the compliant member that is suspended between two drive sprockets when it is desired to perform a bonding operation. The engagement of the tip with the compliant member produces tension in the member. The tension results in a precise and flat configuration within the engaged portion of the member. The flat configuration enhances accurate alignment of workpieces to the compliant member.
A toggle linkage is described as a desirable system for moving the bonding tip with respect to the head.

REFERENCES:
patent: 3627190 (1971-12-01), Ramsey
patent: 3693473 (1972-09-01), Beachner
patent: 3696985 (1972-10-01), Herring et al.

Affiliated with

Also associated with

Rating

Compliant bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compliant bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compliant bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1739004