Complex waveform electroplating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...

Reexamination Certificate

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Details

C205S096000, C205S102000, C205S148000

Reexamination Certificate

active

06919011

ABSTRACT:
A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.

REFERENCES:
patent: 4466864 (1984-08-01), Bacon et al.
patent: 5705230 (1998-01-01), Matanabe et al.
patent: 6071398 (2000-06-01), Martin et al.
patent: 6099711 (2000-08-01), Dahms et al.
patent: 6251250 (2001-06-01), Keigler
patent: 6491806 (2002-12-01), Dubin et al.
patent: 6620303 (2003-09-01), Wong et al.
patent: 2001/0015321 (2001-08-01), Reid et al.
patent: WO 9954527 (1999-10-01), None
U.S. Appl. No. 09/860,758, filed May 21, 2001, Wong et al.

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