Wave transmission lines and networks – Coupling networks – Wave filters including long line elements
Reexamination Certificate
1999-09-10
2002-10-29
Bettendorf, Justin P. (Department: 2817)
Wave transmission lines and networks
Coupling networks
Wave filters including long line elements
C333S001100, C333S134000, C333S238000
Reexamination Certificate
active
06472960
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a complex circuit board comprising an electrode clasped between a dielectric substrate and a magnetic substrate, a nonreciprocal circuit device, a resonator, a filter, a duplexer, a communications device, a circuit module, a method for manufacturing the complex circuit board, and a method for manufacturing the nonreciprocal circuit device.
2. Description of the Related Art
Conventionally, dielectric substrates or magnetic substrates having electrode patterns thereon, forming a capacitance element and/or an inductance element, for example, have been laminated in multiple stages to form a resonator circuit or the like. Depending on the application and desired characteristics and the like, low-profiling is sometimes required, and a conventional complex circuit board has been devised to satisfy such requirements.
A conventional complex circuit board will be explained based on
FIGS. 23 and 24
.
FIG. 23
is a plan view of a conventional complex circuit board, and
FIG. 24
is a cross-sectional view taken along the line W—W of FIG.
23
.
As shown in
FIGS. 23 and 24
, the conventional complex circuit board
110
comprises a dielectric substrate
111
, a magnetic substrate
112
, and an electrode pattern
120
clasped therebetween. The electrode pattern
120
comprises a capacitance element
121
, an inductance element
122
, a transmission line
123
, and the like, and ground electrodes
113
are provided on the outer faces of the dielectric substrate
111
and the magnetic substrate
112
. The complex circuit board
110
of this constitution functions here as a low-pass filter.
In the conventional complex circuit board
110
, the electrode pattern
120
is provided by using plating or the like to form electrodes
120
a
and
120
b
facing each other on the dielectric substrate
111
and the magnetic substrate
112
, respectively, and by providing a connection electrode
120
c
thereabove. The electrode pattern
120
is completed by affixing together the electrodes
120
a
and
120
b
respectively provided on the dielectric substrate
111
and the magnetic substrate
112
, with the connection electrode
120
c
therebetween.
The characteristics of the capacitance element, the inductance element, resistors, transmission lines, and the like, which are provided on the complex circuit board, alter according to their positional relationships to the dielectric substrate and the magnetic substrate. For instance, the inductance element achieves a greater inductance when it is near to the magnetic substrate. Moreover, when the inductance element is near to the magnetic substrate, it can be miniaturized while obtaining the same inductance. Similarly, the capacitance element achieves a greater capacitance when it is near to the dielectric substrate, and it can be miniaturized while still obtaining the same capacitance.
However, in the conventional complex circuit board, since the electrode pattern clasped between the dielectric substrate and the magnetic substrate is formed by affixing together electrodes provided on the dielectric substrate and the magnetic substrate, the entire electrode pattern lies within a single plane. That is, the capacitance element, the inductance element, the resistors, the transmission lines, and the like are disposed all at an equal distance from the dielectric substrate and from the magnetic substrate.
Furthermore, although the inductance element obtains a larger inductance when it is provided nearer to the magnetic substrate, its inductance is lowered when a dielectric substrate is nearby, because the coupling of the inductance element to the dielectric becomes stronger.
Furthermore, in the case of a distributed constant nonreciprocal circuit device, for instance, the electrode comprises a resonator portion and a transmission line portion, and the nonreciprocity of the device when a dc magnetic field is applied thereto is increased by providing the resonator portion near to the magnetic substrate. However, when a dielectric substrate is provided nearby, the coupling of the resonator portion to the dielectric is strengthened, lowering the nonreciprocity of the device.
Therefore, when the capacitance element, the inductance element, and the like formed by the electrode pattern, clasped between the dielectric substrate and the magnetic substrate, are provided within a single plane, there are disadvantages that the inductance can be increased only by a limited value, the elements cannot be miniaturized, and consequently the complex circuit board cannot be miniaturized. There is an additional disadvantage that it is not possible to precisely design the characteristics of the capacitance element, the inductance element, the resistor, the transmission lines, and the like.
SUMMARY OF THE INVENTION
The complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer, communications device, circuit module, method for manufacturing the complex circuit board, and method for manufacturing the nonreciprocal circuit device of the present invention have been realized in consideration of the problems described above, and aim to solve these problems by providing a complex circuit board, a nonreciprocal circuit device, a resonator, a filter, a duplexer, a communications device, and a circuit module, which can be miniaturized and have excellent characteristics, a method for manufacturing the complex circuit board, and a method for manufacturing the nonreciprocal circuit device.
In order to achieve the above objects, the complex circuit board of the present invention comprises a dielectric substrate; a magnetic substrate, a space being provided between the magnetic substrate and the dielectric substrate; and an electrode provided between the dielectric substrate and the magnetic substrate. The electrode is relatively near to the dielectric substrate side at a predetermined position, and is relatively near to the magnetic substrate side at another position, which is different from the predetermined position.
Consequently, a desired distance can be set from the inductance element, the capacitance element, the resistor, the transmission line portion, and the like formed by the electrode pattern to the dielectric substrate or the magnetic substrate, making it possible to design the degree of coupling between these elements and the dielectric and magnetic substrates, enabling the characteristics of these elements to be precisely designed.
For instance, when ferrite is used as the magnetic substrate, it has a dielectric constant of around 10 to 15, a dielectric loss tangent of 1×10
−3
to 1×10
−4
, and permeability of 1 or more. On the other hand, generally used dielectric substrates have a dielectric constant of around 10 to 100, a dielectric loss tangent of 5×10
−4
to 1×10
−5
, and permeability of 1. For this reason, a greater practical dielectric constant and higher capacitance can be obtained when the capacitance element of the electrode is provided near to the dielectric substrate. Furthermore, when the electrode is near to the dielectric substrate, the same capacitance can be obtained with a smaller capacitance element. Further, a transmission line portion with low transmission loss can be obtained by providing the electrode near to a dielectric substrate having a small dielectric loss tangent. Moreover, greater practical permeability and higher inductance can be obtained when the inductance element of the electrode is provided near to the magnetic substrate. Furthermore, when the electrode is near to the magnetic substrate, the same inductance can be obtained with a smaller inductance element.
Preferably, the electrode of the complex circuit board should be very close (i.e., adjacent or in contact with) or near (i.e., spaced a predetermined distance from) the dielectric substrate side at a predetermined position, and very close or near to the magnetic substrate side at another position which is different from the predetermined posit
Ishikawa Yohei
Matsutani Kei
Tokudera Hiromu
Bettendorf Justin P.
Murata Manufacturing Co. Ltd.
Ostrolenk Faber Gerb & Soffen, LLP
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