Complementary transistor structure and method for manufacture

Details Complementary transistor structure and method for manufacture Complementary transistor structure and method for manufacture

1982-07-19

1984-12-04

Saba, William G.

Metal working

Method of mechanical manufacture

Assembling or joining

29576B, 29576E, 29576W, 29578, 29591, 148 15, 148175, 148187, 148188, 148190, 148191, 357 44, 357 50, 357 59, 357 65, 357 90, 357 91, H01L 2122, H01L 2176

Patent

active

044855524

ABSTRACT:
Disclosed is a method of making on a common substrate complementary vertical NPN and PNP transistors having matched high performance characteristics. A barrier region of a first conductivity type is formed on a semiconductor substrate of a second conductivity type. Then, a collector region for one of the complementary transistors of a second conductivity type is formed within the barrier region. It is convenient to simultaneously form isolation regions of a second conductivity type in the substrate while forming the collector region. A collector region of a first conductivity type is then formed in the substrate for the other of the complementary transistors. An epitaxial layer of semiconductor material doped with ions of the first conductivity type is then formed on the surface of the substrate.
In a preferred embodiment the P-type emitter for the PNP transistor is formed prior to a last drive-in treatment by forming a polycrystalline silicon layer on the exposed surface of the base. The polycrystalline silicon is doped with a P-type dopant. Thereafter the transistor structure is subjected to conditions whereby the doping ions contained in the polycrystalline silicon layer are driven into the epitaxial layer to provide a shallow emitter region without effecting dislocations in the silicon lattice of the epitaxial layer.

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