Abrading – Abrading process – With tool treating or forming
Patent
1998-06-19
2000-02-08
Eley, Timothy V.
Abrading
Abrading process
With tool treating or forming
451 36, 451 72, B24B 100
Patent
active
060222654
ABSTRACT:
A complementary conditioning system for use in chemical mechanical polishing (CMP). The present invention functions with a CMP machine adapted for polishing a semiconductor wafer having tungsten components fabricated thereon. A polishing pad is mounted on the CMP machine. The polishing pad has a polishing surface configured for polishing the semiconductor wafer and its tungsten components. The performance of the polishing surface is characterized by a polishing efficiency. A complementary end-effector is mounted on the CMP machine. The complementary end-effector is adapted to chemically complement the tungsten components on the semiconductor wafer. The complementary end-effector is further adapted to contact the polishing surface and improve the polishing efficiency by chemically enhancing the polishing surface, thereby obtaining a more efficient removal rate for the chemical mechanical polishing.
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Drill Charles F.
Gabriel Calvin
Henderson David E.
Russ Richard
Weling Milind
Eley Timothy V.
Nguyen Dung Van
VLSI Technology Inc.
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