Complaint layer metallization

Details Complaint layer metallization Complaint layer metallization

1994-11-23

1996-09-24

Davie, James W.

Coherent light generators

Particular temperature control

Heat sink

257753, 257772, 257 44, H01S 319, H01L 2348

Patent

active

055598170

ABSTRACT:
A compliant layer metallization for relieving thermal and mechanical stress developed between a semiconductor and a semiconductor submount. The compliant layer metallization includes a compliant layer, a wetting layer and a barrier layer. The compliant layer provides thermal and mechanical stress relief. The wetting layer ensures adequate wetting during soldering. The barrier layer prevents diffusion of bonding material into the compliant layer and/or into the semiconductor during solder-bonding. The compliant layer metallization design promotes ease of manufacturing.

REFERENCES:
patent: 4350990 (1982-09-01), Lo
patent: 4929516 (1990-05-01), Pryor et al.

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