Compensating element for stresses of thermal or mechanical orgin

Details Compensating element for stresses of thermal or mechanical orgin Compensating element for stresses of thermal or mechanical orgin

1987-10-27

1989-08-15

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428220, 428334, 428426, 428432, 428544, 428548, 428607, 428615, 428617, 428901, 428335, 174 685, 361397, B32B 900

Patent

active

048573876

ABSTRACT:
A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55.degree. C. to +125.degree. C., and the layer has a thickness between 30.mu. and 200.mu., preferably about 100.mu..

REFERENCES:
patent: 3594895 (1971-07-01), Hill et al.
patent: 3599316 (1971-08-01), Moskal
patent: 4458254 (1984-07-01), Womack
"Some Applications of Shape-Memory Alloys", Journal of Metals, vol. 32, No. 6, Jun. 1980, by C. M. Wayman, pp. 129-136.
"Electronics Review", Electronics International, vol. 56, No. 5, Mar. 1983, pp. 48-49.

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