Compatible self-crosslinking poly (amide-imide) polyepoxide resi

Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing

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156285, 428251, 428285, 4284735, B32B 2700, B32B 2706

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active

047419393

ABSTRACT:
Disclosed is a composition comprising about 5 to about 95 phr of a polyepoxide or other resinous component, about 20 to about 90% of an aprotic solvent, about 5 to about 95 phr of a polyimide having sufficient amic acid functionality to be soluble in the solvent, and sufficient water to hydrolyze the polyimide. A laminate is made from the composition by heating it until the amic acid functionality is substantially eliminated, then impregnating a fibrous substrate with the composition, heating the impregnated substrate to evaporate the solvent and B-stage the composition and form a prepreg, forming a stack of the prepregs, and heating and pressing the stack of prepregs to cure the composition. A wire enamel can also be made from the composition.

REFERENCES:
patent: 3856752 (1974-12-01), Bateman et al.
patent: 4252707 (1981-02-01), Ruid
patent: 4410664 (1983-10-01), Lee
patent: 4487911 (1984-12-01), Lange et al.
patent: 4497922 (1985-02-01), Sato et al.
patent: 4525507 (1985-06-01), Chaker et al.

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