Special receptacle or package – With indicator
Patent
1992-03-31
1994-06-07
Price, William I.
Special receptacle or package
With indicator
206204, 206330, 206332, B65D 7302, B65D 8126
Patent
active
053181816
ABSTRACT:
Plastic encapsulated ICs (28) are susceptible to moisture due to the permeability of molding compounds. ICs (28) may be baked until dry before being shipped to the customer to reduce the risk of cracking. To retain this dry condition, ICs (28) are packaged and shipped in dry-packs. Compartmentalized humidity sensing indicators (14, 16 and 18) are provided for tape and reel IC shipping medium (20) to monitor moisture levels. The indicators (14, 16 and 18) are provided at multiple locations along the carrier tape (22) as a continuous strip with repeating series of humidity indicators. Distinction can be made between the humidity conditions along the length of the carrier tape, which allows identification of problem areas and affected devices. Thus, only portions of devices shipped in tape and reel need rebaking, which offers cycle time and cost advantages over rebaking the entire contents of the carrier tape. Compartmentalized indicators (14, 16 and 18) can also be applied to other IC shipping media such as rails (32) and trays (42).
REFERENCES:
patent: 4971196 (1990-11-01), Kitamura et al.
Gerke Robert D.
Stover Mary M.
Clark Minh-Hien N.
Motorola Inc.
Price William I.
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